Koch Chemie Heavy Cut Foam Pad is brasive sponge for removing strong weathering and deep scratches using the Heavy Cut. The short height of 25mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high level of abrasiveness and excellent hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.