Koch Chemie Polish & Sealing Foam Pad is extra-fine finish sponge for economically and evenly applying sealing products such as the 1K Nano or Lack-Polish grün. The short height of 25mm creates low torsion forces, excellent handling and the highest level of stability. The optimised reticulation (open cellular structure) and cell count contribute to excellent hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.